Renesas Electronics Corporation announced that it has delivered the industry's first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity ...

The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized for automotive ... ST has introduced ...

Littelfuse, Inc. announced the extension of its ITV2718 surface-mountable Li-ion battery protector series. These fuses safeguard Li-ion battery packs against overcurrent ... Littelfuse, Inc. is ...

StratEdge Corporation is proud to announce that it has been awarded the 2024 IMAPS Corporate Recognition Award. The prestigious award was presented on October 1, 2024 ... StratEdge Corporation has ...

Lightmatter announced a strategic partnership with Amkor Technology to create the largest-ever 3D-packaged chip complex utilizing Lightmatter's innovative Passage™ platform. ... We search for industry ...

ST has introduced 40V STripFET F8 MOSFETs with standard threshold voltage (VGS(th)), combining the advantages of the enhanced trench gate technology with superior noise ... ST has introduced an ...

Ironwood is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build ... To characterize the IC ...

Wise-integration announced the opening of its North American Design & Development Center in Ottawa, Ontario, Canada. Led by Christian Cojocaru and staffed by experts ...

$1,000 is the figure to keep in mind to visualize the key role of semiconductor technologies within the automotive industry in 2029. Yole Group's analysts announce a $100 billion ... Semiconductor ...

Renesas Electronics Corporation announced the world's first “"8-in-1" proof of concept* (PoC) for E-Axle systems for electric vehicles (EV), which controls eight functions ... Semiconductor Packaging ...

Back-end equipment spending has always been in the range of 1% of the total semiconductor industry revenue, confirms Yole Group. Hence, the back-end segment is expected ... Semiconductor Packaging ...

Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies ... Master Bond ...